An ultra-micronized grade of dicyandiamide, it is a solid latent curing agent for epoxy resins. It has a mean particle size of approximately 4-5 microns and is one of several grades of Dicyandiamide offered by us that differ in particle size. Dycure 10 typically cures epoxy more quickly than other grades of dicyandiamide. OMICURE DDA 5, similar to other grades of DICY, is dispersed into a resin system where it remains stable until activated by heat. Without an accelerator, such as a substituted urea, dicyandiamide has an activation temperature of about 200 °C and a formulated storage stability of over six months. When catalyzed with a latent accelerator, such as one of the Dycure U500-21 series of substituted ureas, one-component adhesive and sealant formulas can be prepared with lower cure temperatures and excellent stability. The ultrafine particle size of Dycure 10 will aid excellent dispersion, prevent settling, maximize reactivity, promote uniform cure to formulated systems, and avoid issues of ‘hot spots.’ |
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