Substituted urea as a blocked accelerator facilitates the epoxy-dicyandiamide reactions, resulting in a long shelf life material, and excellent latency, and is brilliant for use in adhesive products such as film adhesives. They function effectively in the presence of solvents. Subsequent thermal activation is offered with fast curing and high cross-linking density. Under heat, it decomposes to generate active species such as dimethylamine and isocyanate groups. These active groups accelerate the epoxies curing process and also form additional linkages as a result of the reaction with epoxy groups in the network. Accordingly, substituted ureas have been used successfully for many years as Dicy accelerators. While they cannot cure epoxy resins by themselves, their synergistic performance with DICY makes them outstanding accelerator choices.