In thermosetting epoxy/dicyandiamide (DICY) formulation, the DICY is hardener which provides good processing, outstanding electrical, mechanical features, and extended shelf life. However, this system needs time for curing and elevated curing temperature as close as 200 áµ’C, which is high for most applications. Therefore, it is demanding to speed up the curing process and decrease curing temperature significantly, whilst not sacrificing the shelf life of composite. In this regard, we provide Dycure-Nano Dicy curing agent with extremely fine particle size, which is a pulverized grade of dicyandiamide. They are different in two principal factors compare to dicyandiamide by means of the increased relative surface area and quantum effects. Theses, factors can change or enhance properties such as reactivity, strength, and electrical characteristics. Based on experiments, the Dycure-Nano Dicy offers outstanding adhesion to a variety of substrates and has high glass transition temperature. Due to extremely high surface area, it reacts more fully allowing a faster cure without sacrificing formulation shelf stability. The low temperature reactivity and formulation shelf stability can be balance when the type and loading level of an accelerator has been chosen wisely. In many one component thermosetting epoxy resin formulations, Dycure-Nano Dicy can be employed as curing agents as some following examples:
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